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Document type:
Konferenzbeitrag / Conference Paper
Title:
ESD performance evaluation of powered high-speed interfaces
Title of conference publication:
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)
Conference title:
IEEE International Symposium on Electromagnetic Compatibility (2015, Dresden)
Venue:
Dresden, Germany
Year of conference:
2015
Date of conference beginning:
16.08.2015
Date of conference ending:
22.08.2015
Publishing institution:
IEEE
Year:
2015
Pages from - to:
1101-1105
Language:
Englisch
Abstract:
An approach towards evaluating the ESD performance of high-speed interfaces is presented. By applying ESD stress to powered USB 3.0 interfaces the propagation of very short ESD pulses is investigated. Soft failures caused by TLP stress are put into relation to hard failure thresholds of the unpowered devices as well as soft failures induced by IEC 61000-4-2 pulses.
ISBN:
978-1-4799-6616-5
Department:
Fakultät für Elektrotechnik und Informationstechnik
Institute:
EIT 4 - Institut für Mikroelektronik und Schaltungstechnik
Chair:
Maurer, Linus
Open Access yes or no?:
Ja / Yes
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