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Document type:
Konferenzbeitrag / Conference Paper
Title:
Low profile open MEMS and ASIC packages manufactured by flexible hybrid integration in a roll-to-roll compatible process
Title of conference publication:
2018 48th European Solid-State Device Research Conference (ESSDERC)
Conference title:
European Solid-State Device Research Conference (48., 2018, Dresden)
Venue:
Dresden
Year of conference:
2018
Date of conference beginning:
03.09.2018
Date of conference ending:
06.09.2018
Place of publication:
Piscataway, NJ
Publisher:
IEEE
Year:
2018
Pages from - to:
102-106
Language:
Englisch
ISBN:
978-1-5386-5401-9 ; 978-1-5386-5400-2 ; 978-1-5386-5402-6
Department:
Fakultät für Elektrotechnik und Informationstechnik
Institute:
EIT 2 - Institut für Physik
Chair:
Kutter, Christoph
Open Access yes or no?:
Nein / No
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