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Authors:
Tremmel, Florian; Nagler, Oliver; Kutter, Christoph; Holmer, Rainer 
Document type:
Konferenzbeitrag / Conference Paper 
Title:
Mechanical Robustness Analysis of Semiconductors with a Single Needle Probe Card Using Acoustic Emissions 
Journal:
e-Journal of Nondestructive Testing (eJNDT) 
Volume:
29 
Issue:
10, 36th Conference of the European Working Group on Acoustic Emission, 18-20 September 2024, Potsdam, Germany (EWGAE 2024) 
Organizer (entity):
German Society for Non-Destructive Testing 
Conference title:
Conference of the European Working Group on Acoustic Emission (36., 2024, Potsdam) 
Venue:
Potsdam 
Year of conference:
2024 
Date of conference beginning:
18.09.2024 
Date of conference ending:
20.09.2024 
Publisher:
NDT.net 
Year:
2024 
Pages from - to:
1-10 
Language:
Englisch 
Keywords:
wafer testing ; fracture load limit ; acoustic emission ; crack probability distribution 
Abstract:
The combination of indentation testing and acoustic emission (AE) is widely used to analyze the fracture toughness of test substrates. In the manufacturing of semiconductor devices this material parameter also plays an important role. During the so-called wafer testing inside a wafer prober small probe tips are pressed onto the chip surface to check its performance. To prevent damaging the chip by that, the fracture toughness and load limit of it has to be defined in a prequalification step. Thi...    »
 
ISSN:
1435-4934 
Article ID:
30254 
Department:
Fakultät für Elektrotechnik und Informationstechnik 
Institute:
EIT 2 - Institut für Physik 
Chair:
Hansch, Walter ; Duesberg, Georg ; Kutter, Christoph ; Schein, Jochen 
Open Access yes or no?:
Ja / Yes 
Type of OA license:
CC BY 4.0