ESD performance evaluation of powered high-speed interfaces
Titel Konferenzpublikation:
2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)
Konferenztitel:
IEEE International Symposium on Electromagnetic Compatibility (2015, Dresden)
Tagungsort:
Dresden, Germany
Jahr der Konferenz:
2015
Datum Beginn der Konferenz:
16.08.2015
Datum Ende der Konferenz:
22.08.2015
Verlegende Institution:
IEEE
Jahr:
2015
Seiten von - bis:
1101-1105
Sprache:
Englisch
Abstract:
An approach towards evaluating the ESD performance of high-speed interfaces is presented. By applying ESD stress to powered USB 3.0 interfaces the propagation of very short ESD pulses is investigated. Soft failures caused by TLP stress are put into relation to hard failure thresholds of the unpowered devices as well as soft failures induced by IEC 61000-4-2 pulses.