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- Authors:
- Forster, Christine; Kirscher, Jérôme; Schaller, Rainer; Simon, Sebastian; Maurer, Linus; Pelz, Georg
- Document type:
- Konferenzbeitrag / Conference Paper
- Title:
- Lifetime modeling for a simulative evaluation of package reliability in an automotive application
- Organizer (entity):
- National Institute for Research and Development in Microtechnologies - IMT Bucharest
- Conference title:
- International Semiconductor Conference (2017, Sinaia)
- Conference title:
- International Semiconductor Conference (CAS)
- Venue:
- Sinaia, Romania
- Year of conference:
- 2017
- Date of conference beginning:
- 11.10.2017
- Date of conference ending:
- 14.10.2017
- Year:
- 2017
- Pages from - to:
- 201-204
- Language:
- Englisch
- Abstract:
- A lifetime model based on metamodeling has been combined with a system-level simulation to virtually evaluate the relationship between the application a semiconductor component will be actuated in, its operating and environmental conditions and the package failures. The lifetime model is derived out of accelerated stress tests.
- ISBN:
- 978-1-5090-3985-2
- DOI:
- 10.1109/SMICND.2017.8101200
- Department:
- Fakultät für Elektrotechnik und Informationstechnik
- Institute:
- EIT 4 - Institut für Mikroelektronik und Schaltungstechnik
- Chair:
- Maurer, Linus
- Open Access yes or no?:
- Ja / Yes
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