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Document type:
Konferenzbeitrag / Conference Paper
Title:
Lifetime modeling for a simulative evaluation of package reliability in an automotive application
Organizer (entity):
National Institute for Research and Development in Microtechnologies - IMT Bucharest
Conference title:
International Semiconductor Conference (2017, Sinaia)
Conference title:
International Semiconductor Conference (CAS)
Venue:
Sinaia, Romania
Year of conference:
2017
Date of conference beginning:
11.10.2017
Date of conference ending:
14.10.2017
Year:
2017
Pages from - to:
201-204
Language:
Englisch
Abstract:
A lifetime model based on metamodeling has been combined with a system-level simulation to virtually evaluate the relationship between the application a semiconductor component will be actuated in, its operating and environmental conditions and the package failures. The lifetime model is derived out of accelerated stress tests.
ISBN:
978-1-5090-3985-2
Department:
Fakultät für Elektrotechnik und Informationstechnik
Institute:
EIT 4 - Institut für Mikroelektronik und Schaltungstechnik
Chair:
Maurer, Linus
Open Access yes or no?:
Ja / Yes
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