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- Authors:
- Groos, Gerhard; Jensen, Nils; Denison, Marie; Stecher, Matthias
- Document type:
- Konferenzbeitrag / Conference Paper
- Title:
- Simulation of the Cross-Coupling among Snap Back Devices under Transient High Current Stress
- Collection editors:
- Wachutka, Gerhard; Schrag, Gabriele
- Title of conference publication:
- Simulation of Semiconductor Processes and Devices 2004
- Conference title:
- International Conference on Simulation of Semiconductor Processes and Devices (2004, München)
- Conference title:
- SISPAD 04
- Venue:
- München
- Year of conference:
- 2004
- Date of conference beginning:
- 02.09.2004
- Date of conference ending:
- 04.09.2004
- Place of publication:
- Wien
- Publisher:
- Springer
- Year:
- 2004
- Pages from - to:
- 211-214
- Language:
- Englisch
- ISBN:
- 978-3-7091-0624-2 ; 978-3-7091-7212-4
- DOI:
- 10.1007/978-3-7091-0624-2_48
- URL:
- https://doi.org/10.1007/978-3-7091-0624-2_48
- Department:
- Fakultät für Elektrotechnik und Technische Informatik
- Institute:
- ETTI 1 - Institut für Physik, Elektrotechnik und Automatisierungstechnik
- Chair:
- Groos, Gerhard
- Open Access yes or no?:
- Nein / No
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