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Document type:
Konferenzbeitrag / Conference Paper
Title:
Interface crack propagation between epoxy moulding compound and copper
Title of conference publication:
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Conference title:
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (17., 2016, Montpellier)
Venue:
Montpellier, France
Year of conference:
2016
Date of conference beginning:
18.04.2016
Date of conference ending:
20.04.2016
Place of publication:
Piscataway, NJ
Publisher:
IEEE
Year:
2016
Language:
Englisch
ISBN:
978-150902106-2 ; 978-1-5090-2120-8
Department:
Fakultät für Luft- und Raumfahrttechnik
Institute:
LRT 4 - Institut für Mechanik
Chair:
Lion, Alexander
Open Access yes or no?:
Nein / No
BibTeX