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Document type:
Zeitschriftenartikel / Journal Article
Title:
Experimental Reliability Study of Cumulative Damage Models on State-of-the-Art Semiconductor Technologies for Step-Stress Tests and Misson Profile Stresses
Journal:
Journal of Vacuum Science & Technology B
Volume:
38
Issue:
6
Publication date:
28.09.2020
Year:
2020
Pages from - to:
064001
Language:
Englisch
Article ID:
064001
DOI:
Department:
Fakultät für Elektrotechnik und Informationstechnik
Institute:
EIT 2 - Institut für Physik
Chair:
Hansch, Walter
Open Access yes or no?:
Ja / Yes
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